福彩3d,福彩3d官网,福彩3d代理,福彩3d走势图1.Geographical location Hubei(HuangShi)

2.Site Overview

3.Function of Quality Assurance


Item Technology and Capability
Layers 2~14 layers
Board thickness 16mil~126mil(0.4~3.2mm)
working panel size.(Max) 610*712mm (24*28 inch)
Material Mid-Tg Phenolic & HF, High-TgPhenolic, FR4 & HF FR4,Mid Loss
core dielectric thickness (Min) 3mil(75μm)
Line width/spacing Inner layer:3mil/3mil(H OZ);Outer layer:3.5mil/3.5mil(Copperfoil H OZ)
Inner layer copper thickness(Max) 5 OZ
Drilling Hole Diameter (Min) 0.20mm
Aspect ratio (DHS) (Max) 12:1
Outer Layer Process Pattern plating
Surface Metal Finish ENIG,OSP,HASL(leaded),GoldFinger,ENIG+OSP,OSP+GoldFinger
Special Process Back Drilling,POFV,Buried Vias,Segmented Gold Finger ,etc

福彩3d,福彩3d官网,福彩3d代理,福彩3d走势图5.Technology Support

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